We are delighted to announce that the first Intel® 12th Gen Core™ CPU (formerly known as Alder Lake) systems from ASRock Industrial are now supported by ACRN and available to the open source community.
12th Gen Intel® Core™ desktop processors are the first Intel® Core™ processors to feature performance hybrid architecture for industrial embedded use. It combines two new core microarchitectures, Performance-cores (P-cores) and Efficient-cores (E-cores), on a single processor die. The integrated GPU (iGPU) features enhanced graphics performance for graphics virtualization through Single Root I/O Virtualization (SRIOV), fast Artificial Intelligence (AI) with hardware acceleration and Intel® Xe Architecture and last but not least Real-Time Capabilities such as Intel® Time Coordinated Computing (Intel® TCC) and Time-Sensitive Networking (TSN) that help ensure smooth operation across multiple edge devices in industrial implementations.
In order to provide a seamless experience, the ACRN team has validated two systems for basic functionality based on ACRN v3.0 and above. For further information about these systems, please refer to the URLs below:
For the complete list of platforms supported by ACRN, visit: https://projectacrn.github.io/latest/reference/hardware.html
The ACRN v3.0 release offers a major developer experience update including a new Configurator UI simplifying setup for the hypervisor and VMs, adds additional supported hardware for industrial use cases, Debian packaging, and new features and enhancements.
It’s hard to believe the Project ACRN Hypervisor was announced at the US Embedded Linux Conference three years ago, March 15, 2018. Here’s a summary of key milestones over these last three years, including the most recent merging of ACRN patch sets into the Linux 5.12 kernel. Congratulations to the ACRN community, and Happy Birthday!
ACRN v2.5 introduces a new technology preview for nested virtualization (running a VM inside a guest VM), using an EFI stub as an alternative for end-to-end secure boot, scalability improvements through modularization, and continued improvements to the configuration and build process.